TANK-870e-H110 – High-Performance 6th/7th Generation Intel® Core™ Processor Embedded System

FEATURES

  • 6th/7th Gen Intel® Core™ processor platform with Intel® H110 chipset and DDR4 memory
  • Support dual display VGA+HDMI
  • On-board internal power connector for providing power to add-on cards
  • Great flexibility for hardware expansion

SPECIFICATIONS

Form factor
SBC Form Factor ●CPU:
Intel 7th Gen Core CPU &
Intel® Core™ i7-6700TE (2.4 GHz, quad-core, TDP=35W)
Intel® Core™ i5-6500TE (2.3 GHz, quad-core, TDP=35W)
●Chipset: Intel® H110
●System Memory:
2 x 260-pin DDR4 SO-DIMM, one 4 GB pre-installed (system max: 32GB)
●Power:
Input – DC Jack: 9 V~36 V DC, Terminal Block: 9 V~36 V DC
Consumption: 19 V@3.44 A (Intel® Core™ i7-6700TE with 8 GB memory)
Internal Connector: 5V@3A or 12V@3A
●Reliability:
Operating Shock – Half-sine wave shock 5G, 11ms, 100 shocks per axis
Non-Operating Shock – Half-sine wave shock 15G, 11ms, 100 shocks per axis
Operating Vibration – MIL-STD-810G 514.6C-1 (with SSD)
Non-Operation Vibration – Half-sind mode IEC-60068-2-06
Safety/EMC – CE/FCC
I/O Interface
I/O Ports ●USB: 4 x USB 3.0
●Ethernet:
2 x RJ-45 PCIe GbE by RTL8111G controller
●COM Port:
2 x RS-232/422/485 (DB-9, w/ 2.5kV isolation protection)
●Display:
1 x VGA (Up to 1920 x 1200@60Hz)
1 x HDMI 1.4 (up to 3840×2160@30Hz)
●Audio: 1 x Line-out, 1 x Mic-in
Expansion Slots
Expansion Slots ●PCIe Mini:
1 x Full-size PCIe Mini slot
1 x Full-size PCIe Mini slot (supports mSATA, colay with SATA)
●Backplane:
3A: 1 x PCIe x16, 2 x PCI
3B: 1 x PCIe x16, 1 x PCIe x4, 1 x PCI
3C: 3 x PCI
System
Cooling method / System Fan Fanless
Drive Bays 1 x 2.5" SATA 6Gb/s HDD/SSD bay
Indicators & Buttons
Buttons 1 x Power Button
1 x Reset Button
1 x AT/ATX Switch
Physical Characteristics
Construction Extruded aluminum alloys
Color
Color Dark silver purple + Silver
Dimensions
Dimensions 132.6 x 255.2 x 190 (WxDxH) (mm)
Weight
Weight 4.2 kg/6.3 kg
Environment
Operating Temperature i7-6700TE -20°C ~ 50°C with air flow (SSD)
i5-6500TE -20°C ~ 60°C with air flow (SSD)
Humidity 10% ~ 95%, non-condensing

ORDERING

TANK-870e-H110-i5/4G/3A-R10 Ruggedized Fanless embedded system with Intel® Core i5-6500TE 2.3GHz, (up to 3.3 GHz, Quad Core, TDP 35W), 4GB DDR4 pre-installed memory, 1 x PCIe by 16 & 2 x PCI expansion, VGA/HDMI, 9~36V DC, RoHS
TANK-870e-H110-i5/4G/3B-R10 Ruggedized Fanless embedded system with Intel® Core i5-6500TE 2.3GHz, (up to 3.3 GHz, Quad Core, TDP 35W), 4GB DDR4 pre-installed memory, 1 x PCIe by 16 & 1 x PCIe by 1 & 1 x PCI  expansion, VGA/HDMI, 9~36V DC, RoHS
TANK-870e-H110-i5/4G/3C-R10 Ruggedized Fanless embedded system with Intel® Core i5-6500TE 2.3GHz, (up to 3.3 GHz, Quad Core, TDP 35W), 4GB DDR4 pre-installed memory, 3 x PCI expansion, VGA/HDMI, 9~36V DC, RoHS
TANK-870e-H110-i7/4G/3A-R10 Ruggedized Fanless embedded system with Intel® Core  i7-6700TE 2.4GHz, (up to 3.4 GHz, Quad Core, TDP 35W), 4GB DDR4 pre-installed memory, 1 x PCIe by 16 & 2 x PCI expansion, VGA/HDMI, 9~36V DC, RoHS
TANK-870e-H110-i7/4G/3B-R10 Ruggedized Fanless embedded system with Intel® Core  i7-6700TE 2.4GHz, (up to 3.4 GHz, Quad Core, TDP 35W), 4GB DDR4 pre-installed memory, 1 x PCIe by 16 & 1 x PCIe by 1 & 1 x PCI expansion, VGA/HDMI, 9~36V DC, RoHS
TANK-870e-H110-i7/4G/3C-R10 Ruggedized Fanless embedded system with Intel® Core i7-6700TE 2.4GHz, (up to 3.4 GHz, Quad Core, TDP 35W), 4GB DDR4 pre-installed memory, 3 x PCI expansion, VGA/HDMI, 9~36V DC, RoHS