3.5” SBC supports Intel® 8th Generation Whiskey Lake processor with DDR4 SO-DIMM, Triple display with dual HDMI 1.4, LVDS, Triple GbE, USB 3.1 Gen2, M.2 A key, mPCIe with mSATA support, SATA 6Gb/s, COM and RoHS.
SPECIFICATIONS
| System | |
| CPU | 8th generation Intel® mobile ULT Processor Intel® Core™ i7-8665UE 1.7 GHz (up to 4.4GHz, Quad-core, 8MB cache, TDP=15W) Intel® Core™ i5-8365UE 1.6 GHz (up to 4.1GHz, Quad-core, 6MB cache, TDP=15W) Intel® Core™ i3-8145UE 2.2 GHz (up to 3.9GHz, Dual-core, 4MB cache, TDP=15W) Intel® Celeron® processor 4305UE (up to 2.0GHz, Dual-core, 2MB cache, TDP=15W) Intel® Celeron® processor 4205U (up to 1.8GHz, Dual-core, 2MB cache, TDP=15W) |
| Memory | 1 x DDR4 2400MHz SO-DIMM |
| Memory Max. | 32GB |
| Physical Characteristics | |
| Dimensions (LxWxH) (mm) | 115 X 165 |
| Net Weight | 350g |
| Storage | |
| Storage | 1 x SATA :with 5V SATA power connector |
| I/O Interface | |
| Display Output | 2 x HDMI :1.4 (up to 4096×2160@30Hz) |
| 1 x LVDS :18/24-bit dual-channel LVDS by CH7511B DP to LVDS converter (up to 1920×1200@60Hz) | |
| Ethernet | 3 x LAN :2 x Intel I211AT (colay with I210); 1 x PCIe GbE LAN Intel i219 Controller; |
| Audio | 1 x HD Audio :2×5 pin, support 7.1 channel HD audio by AC-KIT-892HD-R10 |
| I/O Interface | 1 x Internal RS-232 :1×9 pin, P=1.25 |
| 1 x Internal RS-232/422/485 :1×9 pin, P=1.25 (Support Auto Flow Control over RS-485) | |
| 4 x External USB 3.2 Gen1x1 | |
| 2 x Internal USB 2.0 :2×4 pin, P=2.0 | |
| Expansion | 1 x PCIe mini Card Slot :Full-size (w/ SATA signal, support mSATA) |
| 1 x M.2(NGFF) :with A Key 2230 | |
| Power | |
| Power Supply | 12V DC input 1 x Internal power connector (2×2 pin) Support AT/ATX mode |
| Environment | |
| Operating Temperature | -20°C ~ 60°C |
| Storage Temperature | -30°C ~ 70°C |
| Humidity | 5% ~95%, non-condensing |
ORDERING
| WAFER-ULT5-i7-R10 | 3.5″ SBC supports Intel® 14nm 8th Gen (ULT) Core™ i7-8665UE (15W) on-board CPU with DDR4 SO-DIMM support, triple display with Dual HDMI, LVDS, M.2 A key, PCIe mini with mSATA , SATA 6Gb/s, dual COM, support Audio and RoHS |
| WAFER-ULT5-i5-R10 | 3.5″ SBC supports Intel® 14nm 8th Gen (ULT) Core™ i5-8365UE (15W) on-board CPU with DDR4 SO-DIMM support, triple display with Dual HDMI, LVDS, M.2 A key, PCIe mini with mSATA support, SATA 6Gb/s, dual COM, Audio and RoHS |
| WAFER-ULT5-i3-R10 | 3.5″ SBC supports Intel® 14nm 8th Gen (ULT) Core™ i3-8145UE (15W) on-board CPU with DDR4 SO-DIMM support, triple display with Dual HDMI, LVDS, M.2 A key, PCIe mini with mSATA support, SATA 6Gb/s, dual COM, Audio and RoHS |
| WAFER-ULT5-CE-R10 | 3.5″ SBC supports Intel® 14nm 8th Gen (ULT) Celeron™4205U (15W) on-board CPU with DDR4 SO-DIMM support, triple display with Dual HDMI, LVDS, M.2 A key, PCIe mini with mSATA support, SATA 6Gb/s, dual COM, Audio and RoHS |
| WAFER-ULT5-C-R10 | 3.5″ SBC supports Intel® 14nm 8th Gen (ULT) Celeron™4305UE (15W) on-board CPU with DDR4 SO-DIMM support, triple display with Dual HDMI, LVDS, M.2 A key, PCIe mini with mSATA support, SATA 6Gb/s, dual COM, Audio and RoHS |
Heat Sink Introduction
Compared with heat sink, the standout of heat spreader is directly transferred the heat from CPU to the opposite direction of back cover. This solution allows products to fit in environment with space limitation and you could also attach the heat sink on the heat spreader as need. And this is the reason our customer wants to have heat spreader instead of heat sink. If you are interested in that info you can find more details in the product user manual
Plus if your application is not suitable for heat spreader. Wafer ULT5 also provides our customers with a fanless heat sink module as an option. If those solutions still not good enough and you still want to have a different design. We would defiantly happy to customized a new thermal solution for our customer.
