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TANK-XM810 – High-Performance Fanless 10th/11th Gen Intel® Core™ i5/i7 CPU Embedded Computer

  • Supported CPUs:
    Intel® Core™ i3-10320 3.8 GHz (up to 4.6 GHz, quad-core, 65W TDP)
    Intel® Core™ i5-10500 3.1 GHz (up to 4.5 GHz, 6-core, 65W TDP)
    Intel® Core™ i5-10500TE 2.3 GHz (up to 3.7 GHz, 6-core, 35W TDP)
    Intel® Core™ i7-10700E 2.9 GHz (up to 4.5 GHz, 8-core, 65W TDP)
    Intel® Core™ i7-10700TE 2.0 GHz (up to 4.4 GHz, 8-core, 35W TDP)
  • 2 x 2.5GbE ports
  • Multiple USB ports and serial ports
  • Multiple internal expansion boards for flexible selection
  • Various optional backplanes and chassis
  • CE/FCC compliant

TANK-XM810

Modular Edge AI Inference System

The TANK-XM810 has been engineered with the latest technologies to deliver optimized and reliable processing performance at the rugged edge. This product features 11th/10th generation Intel® Core™ processors and comes with multiple I/O combinations and a modular expansion solution. Expansion is supported by our unique eChassis boxes and eBP backplanes.

The TANK-XM810 can support up to 65W processors and can operate in temperatures ranging from -20°C to 60°C. It is designed for use in harsh environments like digital surveillance, transportation system, machine vision and advanced manufacturing.

SPECIFICATIONS

Form factor
SBC Form Factor
  •  CPU:
    10th/11th Gen Intel® Core™ CPU 35/65W
    Intel® Core™ i3-10320 3.8 GHz (up to 4.6 GHz, quad-core, 65W TDP)
    Intel® Core™ i5-10500 3.1 GHz (up to 4.5 GHz, 6-core, 65W TDP)
    Intel® Core™ i5-10500TE 2.3 GHz (up to 3.7 GHz, 6-core, 35W TDP)
    Intel® Core™ i7-10700E 2.9 GHz (up to 4.5 GHz, 8-core, 65W TDP)
    Intel® Core™ i7-10700TE 2.0 GHz (up to 4.4 GHz, 8-core, 35W TDP)
  •  Chipset:
    Q470/Q470E
  •  System Memory:
    2 x SO-DIMM DDR4 2933 MHz (up to 64GB)
  •  Power:
    DC Jack: 12 V~28 V DC
    Terminal Block: 12 V~28 V DC
    Consumption: 12V @ 8A (Intel ® Core™ i9-10900TE with 8GB memory)
I/O Interface
I/O Ports
  •  USB:
    6 x USB 3.2 Gen 2
    2 x USB 2.0
  •  Ethernet:
    2 x RJ-45:
    2 x 2.5 GbE by Intel® I225V (colay I225LM)
  •  COM Port:
    2 x RS-232/422/485
    4 x RS-232
  •  Digital I/O:
    12-bit Digital I/O (6-in/ 6-out)
  •  Display:
    1 x HDMI
    1 x DP++
  •  TPM:
    Support Intel PTT
  •  Watchdog Timer:
    Programmable 1 ~ 255 sec/min
Expansion Slots
Expansion Slots M.2: 2 x 2280 M-key (PCle x2) bay (RAID 0/1 support)
Backplane: Optional
System
Cooling method / System Fan Fanless
4-pin external system fan connector
Drive Bays 1 x 2.5” SATA 6Gb/s HDD/SSD bay
Indicators & Buttons
Buttons 1 x Power button
1 x Reset button
1 x AT/ATX switch
Indicators 1 x Power LED (green)
1 x HDD LED (yellow)
Physical Characteristics
Construction Extruded aluminum alloy
Color
Color Black
Dimensions
Dimensions 230.6 x 256.04 x 76.2
Weight
Weight 3.2/3.5 kg
Environment
Operating Temperature -20°C ~ 60°C with air flow (CPU TDP35W & SSD)
-20°C ~ 50°C with air flow (CPU TDP65W & SSD)
Humidity 10% ~ 95% non-condensing
Operating Vibration Half-sine wave shock 5G, 11ms, 100 shocks per axis (SSD)
Operating Shock MIL-STD-810G 514.6C-1 (SSD)
Safety & EMC CE/FCC compliant
OS Support
OS Support Microsoft Windows 10 / Windows 11, Linux

Ordering Information

TANK-XM810-i7BC-R11 Ruggedized Fanless Embedded System with Intel® i7-10700E 2.9GHz,(up to 4.5GHz, 8-core, TDP 65W), 8GB DDR4 pre-installed memory, 1xHDMI, 1xDP++,12~28V DC and RoHS
TANK-XM810-i7AC-R11 Ruggedized Fanless Embedded System with Intel® i7-10700TE 2.0GHz, (up to 4.4GHz, 8-core, TDP 35W), 8GB DDR4 pre-installed memory, 2xHDMI, 14~28V DC and RoHS
TANK-XM810-i5BC-R11 Ruggedized Fanless Embedded System with Intel® i5-10500 3.1GHz,(up to 4.5GHz, 6-core, TDP 65W), 8GB DDR4 pre-installed memory, 1xHDMI, 1xDP++,12~28V DC and RoHS

Package Contents

Package Content
  • 1 x Wall mounting kit
  • 1 x Screw pack
  • 2 x Terminal block

Options

Part No. Description
EMB-WIFI-KIT02I3-R10 2T2R M.2 wifi module kit for embedded system, IEEEE802.11a/b/g/n/ac/ax, 1 x M.2 AE Key Wireless LAN & Bluetooth 5.2; Intel; AX210.NGWG Module, 2 x RF cable, 2 x Antenna; RoHs
63040-010180-200-RS Adapter Power; FSP; FSP180-ABAN3; 9NA1804008; Active PFC; Vin: 90~264VAC; 180W; Dim: 75.6*151.3*25.4mm; Plug=6.5mm; Cable=1500mm; Erp (NO LOAD 0.5W); Vout: 19VDC; Din 4Pin/lock; CCL; RoHS
32000-000002-RS European power cord
SF-TANK-XM81-R10 External fan for TANK-XM81 Series

Optional Expansion Backplanes

TXCBP-XM81-2A-R10 Expansion backplane module for TANK 81 Series, 2 slot, 1 x PCIe x16 & 1 x PCIe x4
TXCBP-XM81-2B-R10 Expansion backplane module for TANK 81 Series, 2 slot, 2 x PCIe x8
TXCBP-XM81-4A-R10 Expansion backplane module for TANK 81 Series, 4 slot, 1 x PCIe x16 & 2 x PCIe x4 & 1 x PCIe x1 w/ external power supply
TXCBP-XM81-4B-R10 Expansion backplane module for TANK 81 Series, 4 slot, 2 x PCIe x8 & 2 x PCIe x4 w/ external power supply
TXCBP-XM81-4C-R10 Expansion backplane module for TANK 81 Series, 4 slot, 1 x PCIe x16 & 2 x PCI & 1 x PCIe x4
TXCBP-XM81-G1-PW-R10 Expansion backplane module for TANK 81 Series, 4 slot, 1 x PCIe x16 & 1 x PCIe x4 w/ external power supply
TXCBP-XM81-G2-PW-R10 Expansion backplane module for TANK 81 Series, 6 slot, 2 x PCIe x8 & 2 x PCIe x4 w/ external power supply
IDD-X1228150-R10* Extended Power Board for TANK-XM81 Series, 150W DC/DC 12-28V input 12V output
* For expansion cards (graphics cards, accelerator cards) that require independent power supply to provide independent power supply, it must be equipped with a Backplane with W/external power supply function.

Optional Expansion Chassis

TXC-XM81-3S-R10 3-slot expansion chassis for TANK 81 Series
TXC-XM81-4S-R10 4-slot expansion chassis for TANK 81 Series
TXC-XM81-G1-R10 One GPU expansion chassis for TANK 81 Series
TXC-XM81-G2-R10 Dual GPU expansion chassis for TANK 81 Series

Optional Internal Expansion Boards

GPOE-XM81-8P-R10 I/O expansion module for TANK 81 Series, 8 x 2.5G LAN with PoE
TXIOB-XM81-A-R10 I/O expansion module for TANK 81 Series, 2 x M.2 B Key, 1 x M.2 A Key, 1 x PCIe Mini