SPECIFICATIONS
| Form factor | |
| SBC Form Factor | *CPU: Intel® Core™ i7-6822EQ 2GHz *Chipset: Intel® HM170 *Memory: 2 x 260-pin DDR4 SO-DIMM preinstalled one 4 GB (Maximum memory size supported by the system is 32 GB) *Safety & EMC: CE/FCC class B part18, IEC60601-1 v3.1, IEC60601-1-2 V4.0, IEC62304, ISO 14971 *Power: DC Jack : 12V~28V DC(Input) 19V@4.4A(Consumption) |
| I/O Interface | |
| I/O Openings | Reserved IO window for PCIe Mini card expasion |
| I/O Ports | *Display: 1 x VGA, 1 x HDMI2.0, 1 x iDP(optional) *Audio: 1 x Line-out, 1 x Line-in, 1 x Mic-in *Network: 2 x RJ-45 PCIe GbE by Intel® I211 controller 1 x 802.11a/b/g/n/ac 2T/2R (optional) *Others: 2 x RS-232 (DB-9, with 2.5kV isolation) 2 x RS-232/422/485 (DB-9, with 2.5kV isolation) 4 x USB 3.0 2 x USB 2.0 |
| Expansion Slots | |
| Expansion Slots | 1 x PCIe x 16 1 x Half-size PCIe mini 1 x Full-size PCIe mini (support mSATA, colay with SATA) 1 x M.2 (A & E key) |
| System | |
| Cooling method / System Fan | Fanless |
| Drive Bays | HDD: 1 x 2.5″ SATA 6Gb/s HDD/SSD Bay |
| Physical Characteristics | |
| Construction | Extruded aluminum alloys |
| Color | |
| Color | Silver + Greyish blue |
| Dimensions | |
| Dimensions | 294 x 209 x 90.2 |
| Environment | |
| Operating Temperature | -20°C ~ 70°C with air flow (SSD) |
| Humidity | 10%~90% non-condensing |
ORDERING
| HTB-100-HM170-i5/4G-R10 | Ruggedized fanless embedded system with Intel® Core™ i5-6442EQ 1.9 GHz (up to 2.7 GHz, quad core, TDP 25W), 4GB DDR4, PCIe x16 expansion, VGA/HDMI/iDP, COM port, 12~28V DC, Adapter Vin:90~264VAC; 150W; MEDICAL; Vout:19VDC; CCL; R10 |
| HTB-100-HM170-i7/4G-R10 | Ruggedized fanless embedded system with Intel® Core™ i7-6822EQ 2.0 GHz (up to 2.8 GHz, quad core, TDP 25W), 4GB DDR4, PCIe x16 expansion, VGA/HDMI/iDP, COM port, 12~28V DC, Adapter Vin:90~264VAC; 150W; MEDICAL; Vout:19VDC; CCL; R10 |
