Embedded, Mobile, Vehicle Mount PCs - Miller Technologies https://millertech.com/product-category/embedded-mobile-vehicle-mount/ Industrial PCs, Panel PCs, LCD Monitors, LCD Modules & Kits, POP Video Signage Fri, 21 Oct 2022 17:45:25 +0000 en-US hourly 1 https://wordpress.org/?v=6.5.2 https://millertech.com/wp-content/uploads/2019/06/cropped-favicon-192x192_bc36520a3bce3524891692412d_c9e91f015979bab3fcbde4bfed11d144-64x64.png Embedded, Mobile, Vehicle Mount PCs - Miller Technologies https://millertech.com/product-category/embedded-mobile-vehicle-mount/ 32 32 TANK-XM811 – High-Performance 12th Gen Intel® Core™ i5/i7/i9 Processor Fanless Embedded Computer https://millertech.com/product/tank-xm811-high-performance-12th-generation-intel-core-processor-fanless-embedded-computer/?utm_source=rss&utm_medium=rss&utm_campaign=tank-xm811-high-performance-12th-generation-intel-core-processor-fanless-embedded-computer Thu, 20 Oct 2022 20:31:13 +0000 https://millertech.com/?post_type=product&p=9823
  • Supported CPUs:
    Intel® Core™ i5-12500TE 1.9GHz (up to 4.3GHz, 6-core, 35W TDP)
    Intel® Core™ i7-12700TE 1.4GHz (up to 4.6GHz, 12-core, 35W TDP)
    Intel® Core™ i9-12900TE 1.1 GHz (up to 4.8 GHz, 16-core, 35W TDP)
  • 2 x 2.5GbE ports
  • Multiple USB ports and serial ports
  • Multiple internal expansion boards for flexible selection
  • Various optional backplanes and chassis
  • CE/FCC compliant

    • The post TANK-XM811 – High-Performance 12th Gen Intel® Core™ i5/i7/i9 Processor Fanless Embedded Computer appeared first on Miller Technologies.

    ]]>     The TANK-XM811 has been engineered with the latest technologies to deliver optimized and reliable processing performance at the rugged edge. This product features 12th generation Intel® Core™ processors, expandable GPU power, rapid NVMe storage, and scalability through our eChassis modules. This product can be used for various industrial IoT applications, including surveillance, transportation, and advanced manufacturing.

    Furthermore, the system effectively reduces lead times and inventory carrying costs by providing comprehensive modularized options and easy configuration.

    Flexible Expansion with eChassis

    The TANK-XM811 supports the unique eChassis modules that enable performance acceleration through GPUs, accelerators and other add-on cards. Furthermore, comprehensive modularized options and the ease of configuration effectively reduce lead times for customers’ diverse requirements.

    SPECIFICATIONS

    Form factor
    SBC Form Factor
    •  CPU:
      12th Gen Intel® Core™ CPU 35/65W
      Intel® Core™ i5-12500TE 1.9GHz (up to 4.3GHz, 6-core, 35W TDP)
      Intel® Core™ i7-12700TE 1.4GHz (up to 4.6GHz, 12-core, 35W TDP)
      Intel® Core™ i9-12900TE 1.1 GHz (up to 4.8 GHz, 16-core, 35W TDP)
    •  Chipset:
      R680E
    •  System Memory:
      2 x SO-DIMM DDR4 3200 (8GB pre-installed) (up to 64GB)
    •  Power:
      DC Jack: 12 V~28 V DC
      Terminal Block: 12 V~28 V DC
      Consumption: 12V @ 8.8A (Intel® Core™ i9-12900TE with 16GB memory)
    I/O Interface
    I/O Ports
    •  USB:
      8 x USB 3.2 Gen 2
    •  Ethernet:
      2 x RJ-45:
      2 x 2.5 GbE by Intel ® I225V (colay I225LM)
    •  COM Port:
      2 x RS-232/422/485
      4 x RS-232
    •  Digital I/O:
      12-bit Digital I/O (6-in/ 6-out)
    •  Display:
      1 x HDMI
      1 x DP++
    •  TPM:
      Support Intel PTT
    •  Watchdog Timer:
      Programmable 1 ~ 255 sec/min
    Expansion Slots
    Expansion Slots
    •  M.2:
      1 x 2280 M-key (PCIe x4)
      1 x 2230 A-key (USB+PCIe x1, supports vPRO)
    •  Backplane:
      Optional
    System
    Cooling method / System Fan Fanless
    4-pin external system fan connector
    Drive Bays 1 x 2.5＂ SATA 6Gb/s HDD/SSD bay
    Indicators & Buttons
    Buttons 1 x Power button
    1 x Reset button
    1 x AT/ATX switch
    Indicators 1 x Power LED (green)
    1 x HDD LED (yellow)
    Physical Characteristics
    Construction Extruded aluminum alloy
    Color
    Color Black
    Dimensions
    Dimensions 230.6 x 256.04 x 76.2
    Weight
    Weight 3.33/3.7 kg
    Environment
    Operating Temperature -20°C ~ 60°C with air flow (CPU TDP35W & SSD)
    -20°C ~ 50°C with air flow (CPU TDP65W & SSD)
    Humidity 10% ~ 95% non-condensing
    Operating Vibration Half-sine wave shock 5G, 11ms, 100 shocks per axis (SSD)
    Operating Shock MIL-STD-810G 514.6C-1 (SSD)
    Safety & EMC CE/FCC compliant
    OS Support
    OS Support Microsoft Windows 10 / Windows 11, Linux

    Ordering Information

    TANK-XM811-i9AD-R10 Ruggedized Fanless Embedded System With Intel® i9, 16GB RAM,1xHDMI,1xDP++, 12~28V DC and RoHS
    TANK-XM811-i7AC-R10 Ruggedized Fanless Embedded System With Intel® i7, 8GB RAM,1xHDMI,1xDP++, 12~28V DC and RoHS
    TANK-XM811-i5AC-R10 Ruggedized Fanless Embedded System With Intel® i5, 8GB RAM, 1xHDMI, 1xDP++, 12~28V DC and RoHS

    Package Contents

    Package Contents
    • 1 x Wall mounting kit
    • 1 x Screw pack
    • 2 x Terminal block

    Options

    Part No. Description
    EMB-WIFI-KIT02I3-R10 2T2R M.2 wifi module kit for embedded system, IEEEE802.11a/b/g/n/ac/ax, 1 x M.2 AE Key Wireless LAN & Bluetooth 5.2; Intel; AX210.NGWG Module, 2 x RF cable, 2 x Antenna; RoHs
    63040-010180-200-RS Adapter Power; FSP; FSP180-ABAN3; 9NA1804008; Active PFC; Vin: 90~264VAC; 180W; Dim: 75.6*151.3*25.4mm; Plug=6.5mm; Cable=1500mm; Erp (NO LOAD 0.5W); Vout: 19VDC; Din 4Pin/lock; CCL; RoHS
    32000-000002-RS European power cord
    SF-TANK-XM81-R10 External fan for TANK-XM81 Series

    Optional Expansion Backplanes

    TXCBP-XM81-2A-R10 Expansion backplane module for TANK 81 Series, 2 slot, 1 x PCIe x16 & 1 x PCIe x4
    TXCBP-XM81-2B-R10 Expansion backplane module for TANK 81 Series, 2 slot, 2 x PCIe x8
    TXCBP-XM81-4A-R10 Expansion backplane module for TANK 81 Series, 4 slot, 1 x PCIe x16 & 2 x PCIe x4 & 1 x PCIe x1 w/ external power supply
    TXCBP-XM81-4B-R10 Expansion backplane module for TANK 81 Series, 4 slot, 2 x PCIe x8 & 2 x PCIe x4 w/ external power supply
    TXCBP-XM81-4C-R10 Expansion backplane module for TANK 81 Series, 4 slot, 1 x PCIe x16 & 2 x PCI & 1 x PCIe x4
    TXCBP-XM81-G1-PW-R10 Expansion backplane module for TANK 81 Series, 4 slot, 1 x PCIe x16 & 1 x PCIe x4 w/ external power supply
    TXCBP-XM81-G2-PW-R10 Expansion backplane module for TANK 81 Series, 6 slot, 2 x PCIe x8 & 2 x PCIe x4 w/ external power supply
    IDD-X1228150-R10* Extended Power Board for TANK-XM81 Series, 150W DC/DC 12-28V input 12V output
    * For expansion cards (graphics cards, accelerator cards) that require independent power supply to provide independent power supply, it must be equipped with a Backplane with W/external power supply function.

    Optional Expansion Chassis

    TXC-XM81-3S-R10 3-slot expansion chassis for TANK 81 Series
    TXC-XM81-4S-R10 4-slot expansion chassis for TANK 81 Series
    TXC-XM81-G1-R10 One GPU expansion chassis for TANK 81 Series
    TXC-XM81-G2-R10 Dual GPU expansion chassis for TANK 81 Series

    Optional Internal Expansion Boards

    GPOE-XM81-8P-R10 I/O expansion module for TANK 81 Series, 8 x 2.5G LAN with PoE
    TXIOB-XM81-A-R10 I/O expansion module for TANK 81 Series, 2 x M.2 B Key, 1 x M.2 A Key, 1 x PCIe Mini

    The post TANK-XM811 – High-Performance 12th Gen Intel® Core™ i5/i7/i9 Processor Fanless Embedded Computer appeared first on Miller Technologies.

    ]]>         TANK-XM810 – High-Performance Fanless 10th/11th Gen Intel® Core™ i5/i7 CPU Embedded Computer https://millertech.com/product/tank-xm810-high-performance-fanless-10th-11th-gen-intel-core-i5-i7-cpu-embedded-computer/?utm_source=rss&utm_medium=rss&utm_campaign=tank-xm810-high-performance-fanless-10th-11th-gen-intel-core-i5-i7-cpu-embedded-computer Mon, 17 Oct 2022 20:29:11 +0000 https://millertech.com/?post_type=product&p=9790
  • Supported CPUs:
    Intel® Core™ i3-10320 3.8 GHz (up to 4.6 GHz, quad-core, 65W TDP)
    Intel® Core™ i5-10500 3.1 GHz (up to 4.5 GHz, 6-core, 65W TDP)
    Intel® Core™ i5-10500TE 2.3 GHz (up to 3.7 GHz, 6-core, 35W TDP)
    Intel® Core™ i7-10700E 2.9 GHz (up to 4.5 GHz, 8-core, 65W TDP)
    Intel® Core™ i7-10700TE 2.0 GHz (up to 4.4 GHz, 8-core, 35W TDP)
  • 2 x 2.5GbE ports
  • Multiple USB ports and serial ports
  • Multiple internal expansion boards for flexible selection
  • Various optional backplanes and chassis
  • CE/FCC compliant

    • The post TANK-XM810 – High-Performance Fanless 10th/11th Gen Intel® Core™ i5/i7 CPU Embedded Computer appeared first on Miller Technologies.

    ]]>     TANK-XM810

    Modular Edge AI Inference System

    The TANK-XM810 has been engineered with the latest technologies to deliver optimized and reliable processing performance at the rugged edge. This product features 11th/10th generation Intel® Core™ processors and comes with multiple I/O combinations and a modular expansion solution. Expansion is supported by our unique eChassis boxes and eBP backplanes.

    The TANK-XM810 can support up to 65W processors and can operate in temperatures ranging from -20°C to 60°C. It is designed for use in harsh environments like digital surveillance, transportation system, machine vision and advanced manufacturing.

    SPECIFICATIONS

    Form factor
    SBC Form Factor
    •  CPU:
      10th/11th Gen Intel® Core™ CPU 35/65W
      Intel® Core™ i3-10320 3.8 GHz (up to 4.6 GHz, quad-core, 65W TDP)
      Intel® Core™ i5-10500 3.1 GHz (up to 4.5 GHz, 6-core, 65W TDP)
      Intel® Core™ i5-10500TE 2.3 GHz (up to 3.7 GHz, 6-core, 35W TDP)
      Intel® Core™ i7-10700E 2.9 GHz (up to 4.5 GHz, 8-core, 65W TDP)
      Intel® Core™ i7-10700TE 2.0 GHz (up to 4.4 GHz, 8-core, 35W TDP)
    •  Chipset:
      Q470/Q470E
    •  System Memory:
      2 x SO-DIMM DDR4 2933 MHz (up to 64GB)
    •  Power:
      DC Jack: 12 V~28 V DC
      Terminal Block: 12 V~28 V DC
      Consumption: 12V @ 8A (Intel ® Core™ i9-10900TE with 8GB memory)
    I/O Interface
    I/O Ports
    •  USB:
      6 x USB 3.2 Gen 2
      2 x USB 2.0
    •  Ethernet:
      2 x RJ-45:
      2 x 2.5 GbE by Intel® I225V (colay I225LM)
    •  COM Port:
      2 x RS-232/422/485
      4 x RS-232
    •  Digital I/O:
      12-bit Digital I/O (6-in/ 6-out)
    •  Display:
      1 x HDMI
      1 x DP++
    •  TPM:
      Support Intel PTT
    •  Watchdog Timer:
      Programmable 1 ~ 255 sec/min
    Expansion Slots
    Expansion Slots M.2: 2 x 2280 M-key (PCle x2) bay (RAID 0/1 support)
    Backplane: Optional
    System
    Cooling method / System Fan Fanless
    4-pin external system fan connector
    Drive Bays 1 x 2.5” SATA 6Gb/s HDD/SSD bay
    Indicators & Buttons
    Buttons 1 x Power button
    1 x Reset button
    1 x AT/ATX switch
    Indicators 1 x Power LED (green)
    1 x HDD LED (yellow)
    Physical Characteristics
    Construction Extruded aluminum alloy
    Color
    Color Black
    Dimensions
    Dimensions 230.6 x 256.04 x 76.2
    Weight
    Weight 3.2/3.5 kg
    Environment
    Operating Temperature -20°C ~ 60°C with air flow (CPU TDP35W & SSD)
    -20°C ~ 50°C with air flow (CPU TDP65W & SSD)
    Humidity 10% ~ 95% non-condensing
    Operating Vibration Half-sine wave shock 5G, 11ms, 100 shocks per axis (SSD)
    Operating Shock MIL-STD-810G 514.6C-1 (SSD)
    Safety & EMC CE/FCC compliant
    OS Support
    OS Support Microsoft Windows 10 / Windows 11, Linux

    Ordering Information

    TANK-XM810-i7BC-R11 Ruggedized Fanless Embedded System with Intel® i7-10700E 2.9GHz,(up to 4.5GHz, 8-core, TDP 65W), 8GB DDR4 pre-installed memory, 1xHDMI, 1xDP++,12~28V DC and RoHS
    TANK-XM810-i7AC-R11 Ruggedized Fanless Embedded System with Intel® i7-10700TE 2.0GHz, (up to 4.4GHz, 8-core, TDP 35W), 8GB DDR4 pre-installed memory, 2xHDMI, 14~28V DC and RoHS
    TANK-XM810-i5BC-R11 Ruggedized Fanless Embedded System with Intel® i5-10500 3.1GHz,(up to 4.5GHz, 6-core, TDP 65W), 8GB DDR4 pre-installed memory, 1xHDMI, 1xDP++,12~28V DC and RoHS

    Package Contents

    Package Content
    • 1 x Wall mounting kit
    • 1 x Screw pack
    • 2 x Terminal block

    Options

    Part No. Description
    EMB-WIFI-KIT02I3-R10 2T2R M.2 wifi module kit for embedded system, IEEEE802.11a/b/g/n/ac/ax, 1 x M.2 AE Key Wireless LAN & Bluetooth 5.2; Intel; AX210.NGWG Module, 2 x RF cable, 2 x Antenna; RoHs
    63040-010180-200-RS Adapter Power; FSP; FSP180-ABAN3; 9NA1804008; Active PFC; Vin: 90~264VAC; 180W; Dim: 75.6*151.3*25.4mm; Plug=6.5mm; Cable=1500mm; Erp (NO LOAD 0.5W); Vout: 19VDC; Din 4Pin/lock; CCL; RoHS
    32000-000002-RS European power cord
    SF-TANK-XM81-R10 External fan for TANK-XM81 Series

    Optional Expansion Backplanes

    TXCBP-XM81-2A-R10 Expansion backplane module for TANK 81 Series, 2 slot, 1 x PCIe x16 & 1 x PCIe x4
    TXCBP-XM81-2B-R10 Expansion backplane module for TANK 81 Series, 2 slot, 2 x PCIe x8
    TXCBP-XM81-4A-R10 Expansion backplane module for TANK 81 Series, 4 slot, 1 x PCIe x16 & 2 x PCIe x4 & 1 x PCIe x1 w/ external power supply
    TXCBP-XM81-4B-R10 Expansion backplane module for TANK 81 Series, 4 slot, 2 x PCIe x8 & 2 x PCIe x4 w/ external power supply
    TXCBP-XM81-4C-R10 Expansion backplane module for TANK 81 Series, 4 slot, 1 x PCIe x16 & 2 x PCI & 1 x PCIe x4
    TXCBP-XM81-G1-PW-R10 Expansion backplane module for TANK 81 Series, 4 slot, 1 x PCIe x16 & 1 x PCIe x4 w/ external power supply
    TXCBP-XM81-G2-PW-R10 Expansion backplane module for TANK 81 Series, 6 slot, 2 x PCIe x8 & 2 x PCIe x4 w/ external power supply
    IDD-X1228150-R10* Extended Power Board for TANK-XM81 Series, 150W DC/DC 12-28V input 12V output
    * For expansion cards (graphics cards, accelerator cards) that require independent power supply to provide independent power supply, it must be equipped with a Backplane with W/external power supply function.

    Optional Expansion Chassis

    TXC-XM81-3S-R10 3-slot expansion chassis for TANK 81 Series
    TXC-XM81-4S-R10 4-slot expansion chassis for TANK 81 Series
    TXC-XM81-G1-R10 One GPU expansion chassis for TANK 81 Series
    TXC-XM81-G2-R10 Dual GPU expansion chassis for TANK 81 Series

    Optional Internal Expansion Boards

    GPOE-XM81-8P-R10 I/O expansion module for TANK 81 Series, 8 x 2.5G LAN with PoE
    TXIOB-XM81-A-R10 I/O expansion module for TANK 81 Series, 2 x M.2 B Key, 1 x M.2 A Key, 1 x PCIe Mini

    The post TANK-XM810 – High-Performance Fanless 10th/11th Gen Intel® Core™ i5/i7 CPU Embedded Computer appeared first on Miller Technologies.

    ]]>         TB-5745-PCIe – GPU Expansion x16 Box PC with 9th Gen Core-I Series https://millertech.com/product/tb-5745-pcie-gpu-expansion-x16-box-pc-with-9th-gen-core-i-series/?utm_source=rss&utm_medium=rss&utm_campaign=tb-5745-pcie-gpu-expansion-x16-box-pc-with-9th-gen-core-i-series Tue, 05 Jul 2022 15:50:45 +0000 https://millertech.com/?post_type=product&p=9521
  • PCI Express 4.0 x16 GPU Support
  • Mainboard CPU Fanless Design for some Processors and GPU Card Expansion with Smart Fan support
  • Intel 9th Gen. Core i7/i5/i3 Processors / Intel Xeon Processor
  • Removable drive-bays for easy data storage maintenance
  • Flexible expansion through I/O module with miniPCIe and Add-on card

    • The post TB-5745-PCIe – GPU Expansion x16 Box PC with 9th Gen Core-I Series appeared first on Miller Technologies.

    ]]>     The TB-5745-PCIe GPU Expansion x16 Box PC is perfect for those looking for a rugged box PC with a high level of thermal design power (TDP) available for a GPU. The TB-5745-PCIe contains 1x PCIe-16, 2x PCIe-4 and a mini PCIe capable of drawing a total of 400W together (as high as 650W available upon request). This makes the unit compatible with the strongest and most popular graphics cards on the market today, including the AMD Radeon Pro W6600, the MSI GeForce RTX 3090, or other graphics cards that are PCI Express 4.0 x16 compatible. Couple this with the option of fanless cooling systems and you have countless GPU options regardless of environment. In addition to the added GPU compatibility, the TB-5745-PCIe comes equipped with over a dozen unique I/Os, including four USB 3.1 ports, two LAN ports, two COM ports, HDMI, DP, GPIO and more.

    SPECIFICATIONS

    Primary Components

    Processor Family Intel Core-I Series 9th Generation Coffee Lake
    Processor Model 35W CPUs (Fanless) i3-9100E; i5-9500E (Standard); i7-9700E, 65W CPUs (Require External Fan) i3-9100TE; i5-9500TE; i7-9700TE, Xeon Options E-2278GEL; E-2278GE
    Processor Speed Up to 4.7 GHz Turbo
    Memory Type 2x DDR4 SO-DIMM
    Memory Support Up to 32GB (i3), Up to 64GB (i5/i7)
    Storage type 2x 2.5″ SATA Drive Bay for SSD/HDD (easily accessible), 2x 2.5″ SATA Drive Bay for SSD/HDD (Internal), 1x M.2 SATA3 2280 Slot
    Storage support 32GB-1TB, M.2: 64GB-1TB

    Display

    Resolution Supports Up to 4096 x 2160 for HDMI Output, Supports Up to 4096 x 2304 for DP Output

    External I/O ports

    USB 2x USB 2.0, 4x USB 3.1 Gen.1 (Lockable), 1x USB 2.0 (Internal Type A on Motherboard)
    Serial / Com 2x COM
    Serial Protocol Detail RS-232/422/485 DB-9, Default RS-232
    Ethernet / LAN 2x RJ45 GbE LAN
    Video Outputs 1x DisplayPort 1.2, 1x HDMI
    Other Ports 1 x 8-bit GPIO (4x in, 4x out, Isolated 2500Vrms, NPN/PNP Selected, Default NPN)
    Audio 1x Audio Line-Out, 1x Mic-In
    Power Input Port 3-Pin DC-In (Phoenix Type)

    Power

    Input Voltage Range DC 12-36V (Default 24V)
    Max Power consumption 250W for PC, up to 400W reserved for PCIe Cards
    Standard Power Adapter AC100~240V Input, (24V/25A), US AC Power Cord

    Operating Systems

    Windows Windows 11, Windows 10 IoT, Windows 10 Pro
    Linux Linux 4.20.2+

    Compatibility

    Security Hardware TPM 2.0

    Expansion Slots

    Internal Mini PCIe 2x Mini-PCIe
    Internal M.2 1x M.2 for NVME SSD Support
    PCIe Slot Yes
    PCIe Expansion Details PCIe x16 Dual Slot and PCIe x4

    Thermal and Environmental

    Operating Temperature 0°C – 45°C (i7), 0°C – 50°C (i3/i5)
    (32°F – 113°F (i7); 32°F – 122°F (i3/i5))
    Storage Temperature -40°C – 85°C
    (-40°F – 185°F)
    Humidity Range 10% – 90% Non-condensing
    Storage Humidity 10% – 90% Non-condensing
    Cooling Solution 35W CPU (Fanless), 65W CPU (External Fan)

    Enclosure

    Material Metal Steel Chassis
    Color Black
    Led Indicator Light Power
    Control Buttons Power Switch
    Mounting Options Desktop Stand, Wall Mount

    Peripherals & Wireless Connectivity

    WiFi Optional WIFI b/g/n/ac
    BlueTooth Optional Bluetooth 4.0
    Sim card 1x Micro SIM Card Slot

    Dimensions / Weight

    Weight 7 KG (15.4 lbs)
    Dimensions 200 x 200 x 350 mm (7.9 x 7.9 x 13.8 in)

    Certification

    Certifications CE, FCC Class A

    Warranty

    Warranty Up to 5 Years

    The post TB-5745-PCIe – GPU Expansion x16 Box PC with 9th Gen Core-I Series appeared first on Miller Technologies.

    ]]>         TMB-5710 – Medical Edge AI Box PC with Intel Core i5-9500TE/Core i7-9700TE CPU https://millertech.com/product/tmb-5710-medical-edge-ai-box-pc-with-intel-core-i5-9500te-core-i7-9700te-cpu/?utm_source=rss&utm_medium=rss&utm_campaign=tmb-5710-medical-edge-ai-box-pc-with-intel-core-i5-9500te-core-i7-9700te-cpu Fri, 27 May 2022 14:55:07 +0000 https://millertech.com/?post_type=product&p=9399
  • Ready for AI / Medical edge computing
  • Intel 9th Gen. Coffee Lake-S CPU
  • PCIe 16x extension includes extra LAN and COM ports
  • Easily removable HDD
  • Medically certified anti-microbial surface
  • Flat surfaces make sanitation easy

    • The post TMB-5710 – Medical Edge AI Box PC with Intel Core i5-9500TE/Core i7-9700TE CPU appeared first on Miller Technologies.

    ]]>     The TMB-5710 Medical Edge AI Box PC is medically certified hardware designed for AI, edge computing, or other processor-intensive tasks. This medical box pc features two expansion slots for things like AI Cores or graphic cards, as well as a customized PCIe x16 expansion module featuring additional COM and LAN inputs. The Medical Edge AI Box PC has an Intel 9th Gen. Coffee Lake-S CPU and an easily removable HDD to assist with HIPAA patient data storage protocols.

    SPECIFICATIONS

    Primary Components

    Processor Family Intel Core-I Series 9th Generation Coffee Lake
    Processor Model Core i5-9500TE, Core i7-9700TE
    Processor Speed 1.8 GHz, 2.2 GHz
    Memory Type 2x DDR4 SO-DIMM
    Memory Support 32GB
    Storage Type 1x 2.5″ SATA Drive Bay for SSD/HDD (easily accessible), 1x M.2 SATA3 2280 Slot
    Storage Support

    Display

    Resolution
    Brightness
    Viewing Angle
    Number of Colors Supported

    Touch Screen

    Touch Screen
    Light Transmission
    Hardness
    Glass Type
    Glass Thickness
    Lifetime Usage

    External I/O ports

    USB 2x USB 2.0, 4x USB 3.0
    Serial / Com 2x COM
    Serial Protocol Detail 2 x RS232/RS422/RS485 (RI/5V/12V)
    Ethernet / LAN 2x RJ45 GbE LAN
    Video Outputs 1x DisplayPort 1.2, 1x DVI-D, 1x VGA
    Video Inputs
    Audio 1x 3.5mm Audio Line-Out, 1x 3.5mm Audio Line-In, 1x 3.5mm Microphone Jack
    Power Input Port 4-Pin DC-In Jack

    Power

    Input Voltage Range 12-24V DC
    Max Power consumption

    Battery

    Type
    Operating Time
    Quantity

    Operating Systems

    Windows Windows 11, Windows 10 IoT, Windows 10 Pro
    Android
    Linux

    Compatibility

    Security Hardware Optional TPM 2.0
    Software
    Cellular Carriers
    Applications

    Expansion Slots

    Internal Mini PCIe 1x Mini-PCIe
    Internal M.2 1x M.2 for NVME SSD Support (Not at same time with Removable 2.5″ HDD)
    PCI
    PCIe Slot 1x PCI-E (x16), 1x PCI-E (x1)
    PCIe Expansion Details PCIe x 16 (25W-fanless)
    SD Card

    Multimedia

    Speakers
    Camera
    Microphone
    Phone

    Thermal and Environmental

    Operating Temperature 0°C – 35°C
    (32°F – 95°F)
    Storage Temperature -20°C – 60°C
    (-4°F – 140°F)
    Humidity Range 10% – 90% Non-condensing
    Storage Humidity 10% – 90% Non-condensing
    Cooling Solution

    Enclosure

    Material Aluminum
    IP Rating
    Color White
    Antibacterial Housing
    Led Indicator Light HDD Access, Power
    Control Buttons Power Switch
    Programmable Function Buttons
    Shock Rating
    Vibration Rating
    Drop Rating
    Mounting Options
    Approved Cleaning Solutions

    Peripherals & Wireless Connectivity

    WiFi 802.11 ac/a/b/g/n WLAN + BT module
    BlueTooth
    GPS
    Sim Card
    Barcode Scanner
    Smartcard Reader
    Sensors

    Dimensions / Weight

    Dimensions 301 x 295.2 x 130 mm (11.9 x 11.6 x 5.1 in)

    Certification

    Certifications 60601-1 2nd Edition

    Warranty

    Warranty Up to 5 Years

    Accessory Details

    Power Adaptor HPU180

    The post TMB-5710 – Medical Edge AI Box PC with Intel Core i5-9500TE/Core i7-9700TE CPU appeared first on Miller Technologies.

    ]]>         TB-4045-DIN – DIN Mountable Fanless Intel Celeron J1900 CPU Rugged Box PC https://millertech.com/product/tb-4045-din-din-mountable-fanless-intel-celeron-j1900-cpu-rugged-box-pc/?utm_source=rss&utm_medium=rss&utm_campaign=tb-4045-din-din-mountable-fanless-intel-celeron-j1900-cpu-rugged-box-pc Thu, 26 May 2022 20:16:31 +0000 https://millertech.com/?post_type=product&p=9393
  • Intel Quad-Core Celeron J1900 CPU
  • Wide Operating Temp (-20°C – 70°C)
  • DIN Rail Mountable
  • Fanless, Rugged Housing

    • The post TB-4045-DIN – DIN Mountable Fanless Intel Celeron J1900 CPU Rugged Box PC appeared first on Miller Technologies.

    ]]>     The TB-4045-DIN is built for tough environments where dust, heat and machine vibration would damage a consumer-grade computer. It can be mounted onto a DIN rail on your production line, in a control cabinet or on your shop floor. The TB-4045-DIN is fanless and has a wide operating temperature range. Overall, it is much more rugged and reliable than a consumer-grade PC, but comes in at a similar price-point, allowing you to save overall cost, by cutting down on costly downtime and repairs or replacements.

    SPECIFICATIONS

    Primary Components

    Processor Family Intel Celeron Bay Trail
    Processor Model J1900 Quad Core
    Processor Speed 2.0 GHz
    Memory Type 1x DDR3L SO-DIMM
    Memory Support 4GB, 8GB
    Storage Type 1x 2.5″ SATA Drive Bay for SSD/HDD, mSATA
    Storage Support 32GB-2TB

    Display

    Resolution
    Brightness
    Viewing Angle
    Number of Colors Supported

    Touch Screen

    Touch Screen
    Light Transmission
    Hardness
    Glass type
    Glass Thickness
    Lifetime Usage

    External I/O Ports

    USB 2x USB 2.0, 2x USB 3.0
    Serial / Com 4x COM
    Serial Protocol Detail Com1 configurable in BIOS RS-232/422/485; Com2 RS-232; COM3 and 4 RS-485 only
    Ethernet / LAN 2x RJ45 GbE LAN
    Video Outputs 1x HDMI, 1x VGA
    Video Inputs
    Other Ports OPTIONAL: 1x 8-bit GPIO (4x DI, 4x DO)
    Audio
    Power Input Port 2-Pin Power Switch, 3-Pin DC-In (Phoenix Type)

    Power

    Input Voltage Range 9-36V DC
    Max Power Consumption

    Battery

    Type
    Operating Time
    Quantity

    Operating Systems

    Windows Windows 10 IoT, Windows 10 Pro, Windows 7 Pro
    Android
    Linux

    Compatibility

    Security Hardware Optional TPM 2.0
    Software
    Cellular Carriers
    Applications

    Expansion Slots

    Internal Mini PCIe 1x Mini-PCIe
    Internal M.2
    PCI
    PCIe Slot
    SD card

    Multimedia

    Speakers
    Camera
    Microphone
    Phone

    Thermal and Environmental

    Operating Temperature -20°C – 70°C
    (-4°F – 158°F)
    Storage Temperature -40°C – 85°C
    (-40°F – 185°F)
    Humidity Range 10% – 90% Non-condensing
    Storage Humidity 10% – 90% Non-condensing
    Cooling Solution Passive – Fanless with Heatsink

    Enclosure

    Material Titanium Aluminum
    Ip Rating
    Color Black, Gray
    Antibacterial Housing
    Led Indicator Light
    Control Buttons Power Button
    Programmable Function Buttons
    Shock Rating
    Vibration Rating
    Drop Rating
    Mounting Options Wall Mount
    Approved Cleaning Solutions

    Peripherals & Wireless Connectivity

    WiFi Optional WIFI via mPCIe expansion
    BlueTooth Optional Bluetooth 4.0
    GPS
    Mobile Network 4G LTE Optional Cellular data via mPCIe expansion
    Sim card 1x SIM Card Slot
    Barcode Scanner
    Smartcard Reader
    Sensors

    Dimensions / Weight

    Weight 1.05 KG (2.3 lbs)
    Dimensions 180x130x35.5 mm (7.1 x 5.1 x 1.4 in)

    Certification

    Certifications

    Warranty

    Warranty Up to 5 Years

    The post TB-4045-DIN – DIN Mountable Fanless Intel Celeron J1900 CPU Rugged Box PC appeared first on Miller Technologies.

    ]]>         TB-4045 – Fanless Intel Celeron J1900 CPU Rugged Box PC https://millertech.com/product/tb-4045-fanless-intel-celeron-j1900-cpu-rugged-box-pc/?utm_source=rss&utm_medium=rss&utm_campaign=tb-4045-fanless-intel-celeron-j1900-cpu-rugged-box-pc Thu, 26 May 2022 20:03:52 +0000 https://millertech.com/?post_type=product&p=9389
  • Intel Celeron J1900 CPU
  • Wall Mountable, Compact Form Factor
  • Fanless, Rugged Housing
  • Wide Operating Temp (-20°C – 70°C)

    • The post TB-4045 – Fanless Intel Celeron J1900 CPU Rugged Box PC appeared first on Miller Technologies.

    ]]>     The TB-4045 Rugged Mini PC is a compact, reliable solution, at a similar price-point to consumer-grade PCs. This box PC is made for production lines, warehouses, control cabinets, and other enduring environments with heat, dust, or machine vibration that would damage a consumer-grade PC. The TB-4045 is small enough to fit next to your equipment and provide you a smooth windows operating system experience. It is fanless and has a wide operating temperature range. It also has abundant inputs/outputs and it runs on a quad-core Celeron CPU.

    SPECIFICATIONS

    Primary Components

    Processor Family Intel Celeron Bay Trail
    Processor Model J1900 Quad Core
    Processor Speed 2.0 GHz
    Memory Type 1x DDR3L SO-DIMM
    Memory Support 4GB, 8GB
    Storage Type 1x 2.5″ SATA Drive Bay for SSD/HDD, mSATA
    Storage Support 32GB-2TB

    Display

    Resolution
    Brightness
    Viewing Angle
    Number of Colors Supported

    Touch Screen

    Touch Screen
    Light Transmission
    Hardness
    Glass type
    Glass Thickness
    Lifetime Usage

    External I/O Ports

    USB 2x USB 2.0, 2x USB 3.0
    Serial / Com 4x COM
    Serial Protocol Detail Com1 configurable in BIOS RS-232/422/485; Com2 RS-232; COM3 and 4 RS-485 only
    Ethernet / LAN 2x RJ45 GbE LAN
    Video Outputs 1x HDMI, 1x VGA
    Video Inputs
    Other Ports OPTIONAL: 1x 8-bit GPIO (4x DI, 4x DO)
    Audio
    Power Input Port 2-Pin Power Switch, 3-Pin DC-In (Phoenix Type)

    Power

    Input Voltage Range 9-36V DC
    Max Power Consumption

    Battery

    Type
    Operating Time
    Quantity

    Operating Systems

    Windows Windows 10 IoT, Windows 10 Pro, Windows 7 Pro
    Android
    Linux

    Compatibility

    Security Hardware Optional TPM 2.0
    Software
    Cellular Carriers
    Applications

    Expansion Slots

    Internal Mini PCIe 1x Mini-PCIe
    Internal M.2
    PCI
    PCIe Slot
    SD card

    Multimedia

    Speakers
    Camera
    Microphone
    Phone

    Thermal and Environmental

    Operating Temperature -20°C – 70°C
    (-4°F – 158°F)
    Storage Temperature -40°C – 85°C
    (-40°F – 185°F)
    Humidity Range 10% – 90% Non-condensing
    Storage Humidity 10% – 90% Non-condensing
    Cooling Solution Passive – Fanless with Heatsink

    Enclosure

    Material Titanium Aluminum
    Ip Rating
    Color Black, Gray
    Antibacterial Housing
    Led Indicator Light
    Control Buttons Power Button
    Programmable Function Buttons
    Shock Rating
    Vibration Rating
    Drop Rating
    Mounting Options Wall Mount
    Approved Cleaning Solutions

    Peripherals & Wireless Connectivity

    WiFi Optional WIFI via mPCIe expansion
    BlueTooth Optional Bluetooth 4.0
    GPS
    Mobile Network 4G LTE Optional Cellular data via mPCIe expansion
    Sim card 1x SIM Card Slot
    Barcode Scanner
    Smartcard Reader
    Sensors

    Dimensions / Weight

    Weight 1.05 KG (2.3 lbs)
    Dimensions 180x130x35.5 mm (7.1 x 5.1 x 1.4 in)

    Certification

    Certifications

    Warranty

    Warranty Up to 5 Years

    The post TB-4045 – Fanless Intel Celeron J1900 CPU Rugged Box PC appeared first on Miller Technologies.

    ]]>         TB-3445 – Fanless Intel N3350/4200 Slim & Rugged PC with Abundant I/O https://millertech.com/product/tb-3445-fanless-intel-n3350-4200-slim-rugged-pc-with-abundant-i-o/?utm_source=rss&utm_medium=rss&utm_campaign=tb-3445-fanless-intel-n3350-4200-slim-rugged-pc-with-abundant-i-o Fri, 23 Jul 2021 13:56:34 +0000 https://millertech.com/?post_type=product&p=8178
  • Intel N3350/4200 CPU
  • Slim & Rugged Chassis
  • Abundant Inputs/Outputs
  • DIN Rail Mountable
  • Wide Range DC 9~36V Power Input

    • The post TB-3445 – Fanless Intel N3350/4200 Slim & Rugged PC with Abundant I/O appeared first on Miller Technologies.

    ]]>     The TB-3445 is a mini box PC designed to work in dirty, hot environments for years and years. This computer is low cost and compact, while still being rugged and industrial. Compared to similar low-cost computer solutions, the TB-3445 is much more reliable. This computer is built to run 24/7 in your manufacturing facility or warehouse. It is ideal for connecting your PLCs to the cloud, monitoring the production floor from an office, and taking actions such as controlling machinery, turning on/off pumps, or stopping production. This PC can be DIN rail mounted or Wall mounted with built-in expansion tabs, and fits lots of I/Os into a small package. Contact Us today for a TB-3445 quotation.

    SPECIFICATIONS

    Primary Components

    Processor Family Intel Celeron Apollo Lake
    Processor Model N3350 Dual Core
    Processor Speed Up to 2.4 GHz
    Memory Type 1x DDR3L SO-DIMM
    Memory Support 4GB, 8GB
    Storage type mSATA
    Storage support 64GB (Standard), up to 256GB (Optional)

    External I/O ports

    USB 1x USB 2.0, 2x USB 3.0 (with lock), 1x USB 3.0 type C
    Serial / Com 2x COM
    Serial Protocol Detail 2x RS-232/422/485
    Ethernet / LAN 1x RJ45 GbE LAN
    Video Outputs 1x DisplayPort
    Power Input Port 3-Pin DC-In (Phoenix Type)

    Power

    Input Voltage Range 9-36V DC
    Max Power consumption 33W
    Standard Power Adapter Optional 12V AC/DC Adapter

    Operating Systems

    Windows Windows 10 IoT, Windows 10 Pro
    Linux Linux 4.20.2

    Expansion Slots

    Internal Mini PCIe 1x Mini-PCIe
    PCIe Expansion Details 1 x mini PCIe for Wi-Fi/GPS/LTE
    SD card 1x Micro SD Slot
    Expansion Module support Default expansion: 2 x COM (DB9); Optional expansion requires MOQ – 3 x COM (Terminal Block); 2 x USB 2.0; 16 channel GPIO

    Thermal and Environmental

    Operating Temperature -20°C – 60°C
    (-4°F – 140°F)
    Storage Temperature -40°C – 85°C
    (-40°F – 185°F)
    Humidity Range 10% – 90% Non-condensing
    Storage Humidity 10% – 90% Non-condensing
    Cooling Solution Passive – Fanless with Heatsink

    Enclosure

    Material Aluminum
    Color Black, Gray
    Led Indicator Light Power
    Control Buttons Power Button
    Mounting Options DIN Rail Mount, Wall Mount

    Peripherals & Wireless Connectivity

    WiFi Optional

    Dimensions / Weight

    Weight .78 KG (1.7 lbs)
    Dimensions 140x120x42 mm (5.5 x 4.7 x 1.7 in)

    Warranty

    Warranty Up to 5 Years

    The post TB-3445 – Fanless Intel N3350/4200 Slim & Rugged PC with Abundant I/O appeared first on Miller Technologies.

    ]]>         TANK-880-Q370 – Fanless High-Performance 8th/9th Generation Intel® Core™ Processor Box PC https://millertech.com/product/tank-880-q370-fanless-high-performance-8th-9th-generation-intel-core-processor-box-pc/?utm_source=rss&utm_medium=rss&utm_campaign=tank-880-q370-fanless-high-performance-8th-9th-generation-intel-core-processor-box-pc Wed, 09 Jun 2021 18:02:11 +0000 https://millertech.com/?post_type=product&p=7890
  • 8th/9th Gen Intel® Core™ processor platform with Intel® Q370 chipset and DDR4 memory
  • Dual independent displays with high resolution support
  • Rich high-speed I/O interfaces
  • On-board internal power connector for providing power to add-on cards
  • Four accessible 2.5” HDD/SSD SATA 6 Gb/s bay (with RAID 0/1/5/10 support)
  • Great flexibility for hardware expansion

    • The post TANK-880-Q370 – Fanless High-Performance 8th/9th Generation Intel® Core™ Processor Box PC appeared first on Miller Technologies.

    ]]>     SPECIFICATIONS

    Form factor
    SBC Form Factor ●CPU:
    8th Gen Intel® Core™ CPU &
    Intel® Core™ i7-9700TE 1.8GHz (up to 3.8GHz, 8-core, TDP 35W)
    Intel® Core™ i5-9500TE 2.2GHz (up to 3.6GHz, 6-core, TDP 35W)
    ●Chipset:
    Intel® Q370
    ●System Memory:
    2 x SO-DIMM DDR4 2666/ 2400 (8GB pre-installed) (up to 64GB)
    ●Power:
    DC Jack: 9 V~36 V DC
    Terminal Block: 9 V~36 V DC
    Consumption: 19V @ 5.4A (Intel® Core™ i7-9700TE with 8GB memory)
    ●Reliability:
    Operating Shock: Half-sine wave shock 5G, 11ms, 100 shocks per axis
    Operating Vibration: MIL-STD-810G 514.6C-1 (SSD)
    Safety/EMC: CE/FCC
    I/O Interface
    I/O Ports ●Display:
    1 x HDMI 1.4b (up to 4096 x 2304@30Hz)
    1 x DP (up to 4096 x 2304@60Hz)
    ●6 x USB 3.2 Gen1
    ●Ethernet:
    3 x RJ-45
    1 x PCIe GbE by I219 controller
    2 x PCIe GbE by I210 controller
    ●COM Port:
    3 x RS-232/422/485 with AFC (DB-9 w/2.5 kV isolation protection)
    ● Digital I/O:
    8 bit Digital I/O (4-input / 4-output)
    ●Audio:
    1 x Mic in, 1 x Line out
    ●TPM:
    1 x TPM 2.0 (optional)
    Expansion Slots
    Expansion Slots ●M.2:
    1 x 2230 A key (PCIe x2/ USB2.0)
    2 x 2280 M key (PCIe x2)
    ●PCIe Mini:
    1 x Full-size (PCIe/ USB 2.0/ SATA)
    ●Backplane:
    1 x PCIe by 16
    1 x PCIe by 1
    2 x PCIe by 4
    System
    Cooling method / System Fan Fanless
    Drive Bays 4 x 2.5” HDD/SSD SATA 6Gb/s bay (with RAID 0/1/5/10 support)
    Indicator & Buttons
    Buttons 1 x Power Button
    1 x Reset Button
    1 x AT/ATX Switch
    Indicators 1 x HDD LED
    1 x Power LED
    Physical Characteristics
    Construction Extruded aluminum alloys
    Color
    Color Black C + Silver
    Dimensions
    Dimensions 169 x 255.2 x 225 mm
    Weight
    Weight 5.4 kg/8.45 kg
    Environment
    Operating Temperature -20°C ~ 60°C with air flow (SSD)
    Humidity 10% ~ 95%, non-condensing

    ORDERING

    TANK-880-Q370-i7R/8G/4A-R10 Ruggedized Fanless embedded system with Intel®  i7-9700TE  1.8GHz, (up to 3.8GHz, 8-core, TDP 35W), 8GB DDR4 pre-installed memory, 1 x PCIe by 16 & 2 x PCIe by 4 & 1 x PCIe by 1 expansion, HDMI/DP, 9~36V DC, RoHS
    TANK-880-Q370-i5R/8G/4A-R10 Ruggedized Fanless embedded system with Intel® i5-9500TE  2.2GHz, (up to 3.6Hz, 6-core, TDP 35W), 8GB DDR4 pre-installed memory, 1 x PCIe by 16 & 2 x PCIe by 4 & 1 x PCIe by 1 expansion, HDMI/DP, 9~36V DC, RoHS

    The post TANK-880-Q370 – Fanless High-Performance 8th/9th Generation Intel® Core™ Processor Box PC appeared first on Miller Technologies.

    ]]>         FLEX-BX100-ULT5 – Fanless 8th gen Intel® 8th Generation Intel® Core™ i5 https://millertech.com/product/flex-bx100-ult5-fanless-8th-gen-intel-8th-generation-intel-core-i5/?utm_source=rss&utm_medium=rss&utm_campaign=flex-bx100-ult5-fanless-8th-gen-intel-8th-generation-intel-core-i5 Wed, 09 Jun 2021 17:41:26 +0000 https://millertech.com/?post_type=product&p=7886
  • 8th gen Intel® Whiskey Lake-U processors
  • Low power consumption and fanless design
  • Support PoE PD power
  • Support NVMe SSD

    • The post FLEX-BX100-ULT5 – Fanless 8th gen Intel® 8th Generation Intel® Core™ i5 appeared first on Miller Technologies.

    ]]>     SPECIFICATIONS

    Form factor
    SBC Form Factor
    • CPU:
      8th Generation Intel® Core™ i5-8365UE
      8th Generation Intel® Celeron® 4305UE
    • Chipset: Intel® Whiskey Lake-U
    • System Memory:
      2 x 260-pin DDR4 SO-DIMM, one 4 GB pre-installed (system max: 32GB)
    • Power:
      Input – DC Jack: 12 V DC
      Consumption: 12 V@3.5 A (Intel® Core™ i5-8365UE with 4 GB memory)
    • Reliability:
      Shock – 10G acceleration part to part (11ms)
      Vibration 5~17Hz, 0.1 double amplitude displacement 17~640Hz 1.5G acceleration peak to peak
      Safety/EMC – CE/FCC
    I/O Interface
    I/O Ports 1 x HDMI
    2 x PoE GbE LAN* (RJ-45)
    1 x GbE LAN (RJ-45)
    1 x RS-232/422/485 (DB-9, COM1)
    1 x RS-232 (DB-9, COM2)
    4 x USB 3.2 Gen 2 (10Gb/s) Type-A
    1 x Line-out
    Expansion Slots
    Expansion Slots M.2 2230 A-Key (PCIe x1, USB 2.0; support Wi-Fi, BT)
    M.2 2280 M-Key (PCIe x4; support NVMe SSD)
    System
    Cooling method / System Fan Fanless
    Drive Bays 2.5” HDD/SSD SATA 3(6.0Gb/s) bay
    Indicator & Buttons
    Buttons 1 x Power button with LED indicator
    1 x Reset button
    1 x AT/ATX mode switch
    1 x Clear CMOS button
    Color
    Color PANTONE 296 C
    Dimensions
    Dimensions 356.5x 222 x 44(mm)
    Weight
    Weight 2.8/5.5kg
    Environment
    Operating Temperature -10°C ~ 60°C (with air flow)
    Humidity 10% ~ 95% (non-condensing)

    ORDERING

    FLEX-BX100-ULT5-i5/4G-R10 Fanless embedded system with Intel® 14nm 8th Whiskey Lake Core- i5-8365UE (6M Cache, up to 4.10 GHz) TDP 15W on-board Processor (ULT), 4GB DDR4 RAM x1, 12VDC input, R10
    FLEX-BX100-ULT5-C/4G-R10 Fanless embedded system with Intel® 14nm 8th Whiskey Lake Celeron® 4305UE (2M Cache, 2.0 GHz) TDP 15W on-board Processor (ULT), 4GB DDR4 RAM x1, 12VDC input, R10

    The post FLEX-BX100-ULT5 – Fanless 8th gen Intel® 8th Generation Intel® Core™ i5 appeared first on Miller Technologies.

    ]]>         ECW-281B-BT – Fanless Embedded System with Intel® Celeron® J1900 Quad-Core Processor https://millertech.com/product/ecw-281b-bt-fanless-embedded-system-with-intel-celeron-j1900-processor/?utm_source=rss&utm_medium=rss&utm_campaign=ecw-281b-bt-fanless-embedded-system-with-intel-celeron-j1900-processor Tue, 08 Jun 2021 19:14:09 +0000 https://millertech.com/?post_type=product&p=7870
  • Fanless system with Intel® Celeron® J1900 Processor
  • Supports four COM ports (three RS-232, one RS-422/485)
  • 12V DC and 9 V~36 V DC models available
  • Wide operating temperature: -20°C ~ 60°C with SSD

    • The post ECW-281B-BT – Fanless Embedded System with Intel® Celeron® J1900 Quad-Core Processor appeared first on Miller Technologies.

    ]]>     SPECIFICATIONS

    Form factor
    SBC Form Factor CPU: Intel® Celeron® J1900 processor
    (2 GHz, quad-core, 2 MB cache, TDP=10W)
    Chipset: SoC
    System Memory:
    1 x 204-pin 1066/1333 MHz single-channel DDR3L SO-DIMM (system max. 8 GB)
    I/O Interface
    I/O Ports 1 x USB 3.0
    3 x USB 2.0
    Ethernet:
    LAN 1: PCIe GbE by Intel® I210 controller
    LAN 2: PCIe GbE by Intel® I211 controller
    COM Port:
    3 x RS-232
    1 x RS-422/485
    Digital I/O: 8-bit digital I/O
    Display: 1 x VGA
    Resolution: VGA: Up to 2560×1600@60Hz
    Audio: 1 x Line out
    Wireless: 1 x 802.11b/g/n (optional)
    Expansion Slots
    Expansion Slots 1 x Full-size PCIe Mini card slot (supports mSATA)
    1 x Half-size PCIe Mini card (only for iRIS)
    System
    Cooling method / System Fan Fanless
    Drive Bays 1 x 2.5” SATA 3Gb/s HDD bay
    Color
    Color Black
    Dimensions
    Dimensions 229 x 64 x 132
    Weight
    Weight 2.1 kg / 3.9 kg
    Environment
    Operating Temperature -20°C~60°C with air flow (SSD)
    Humidity 10% ~ 95%, non-condensing

    ORDERING

    ECW-281BWD-BTi-J1/2GB-R20 Fanless embedded system with WAFER-BT-R20,with Intel® Celeron J1900 2GHz, 4 serial ports,with 2GB DDR3L pre-installed SO-DIMM memory, 9~36VDC in, w/o adapter, black, RoHS
    ECW-281B-BTi-J1/2GB-R20 Fanless embedded system with WAFER-BT-R20,with Intel® Celeron J1900 2GHz, 4 serial ports,with 2GB DDR3L pre-installed SO-DIMM memory,12VDC in, 60W power adapter, black, RoHS

    OPTIONS

    ECW-281B-BT-WES7E64-R20 OS Image with Windows® Embedded Standard 7 E 64Bit for ECW-281BT Series, with DVD-ROM, RoHS, R20
    DK-100-R10 VESA 100 to DIN-Rail mounting kit

    PACKAGE CONTENTS

    • 1 x Power cord only for 12V
    • 1 x Wall mount bracket
    • 1 x 12V 60W power adapter only for 12V
    • 1 x Screw set

    The post ECW-281B-BT – Fanless Embedded System with Intel® Celeron® J1900 Quad-Core Processor appeared first on Miller Technologies.

    ]]>